Product Name

Features/Benefits

GOLD FIRE DIP

Alkaline cyanide solution for removal of superficial karat gold oxide films.  Replaces costly and dangerous peroxide/cyanide ‘bomb’ dips.

SILVER FIRE DIP

Alkaline cyanide solution for removal of superficial pure and sterling silver films. 

GOLD RECLAIM RESIN

Ion-exchange resin for the removal of trivalent gold acid waste streams/drag-outs.

GOLD RECLAIM RESIN AF

Strong basic ion-exchange resin for the removal of gold from a wide pH spectrum.  Formulated to minimize the generation of fungus and bacterial growth.

PALLADIUM RESIN - ACID

Ion-exchange resin for the removal of palladium from mildly acidic waste streams/drag-outs.

PALLADIUM RESIN - NEUTRAL

Ion-exchange resin for the removal of palladium from neutral/alkaline waste streams/drag-outs.

SILVER RECLAIM RESIN

Ion-exchange resin for the removal of silver from waste streams/drag-outs.

BASE METAL RESIN

Ion-exchange resin for the removal of copper, nickel, zinc, lead, iron from waste streams/drag-outs.

IONEX 447 MEDIA

High capacity synthetic media that is highly selective for the removal of lead, fluoride, arsenic and antimony from waste streams/drag-outs.

GOLD STRIP DB BLEND

Dry salt gold strip formulation (1 part concentrate to 9 parts water). Includes Potassium cyanide. Minimal attack on nickel, copper and brass alloys.

GOLD STRIPPER I

Concentrated gold strip formulation (1 part concentrate to 9 parts water). Sodium cyanide not included.

GOLD STRIPPER II

Concentrated gold strip formulation. Potassium cyanide not included.

GOLD STRIPPER III

Concentrated gold strip formulation. Eliminates the use of lead as a catalyst. Potassium cyanide not included.

NICKEL STRIPPER I

Non-cyanide nickel strip formulated to remove nickel from copper and brass alloy substrates.

DMG NICKEL TEST KIT

All inclusive test kit used for semi-quantitative analysis of nickel presence in nickel-free jewelry applications.

NICKEL STRIPPER II

Nickel strip formulated to remove nickel from copper and brass alloy substrates.

SPOT-FREE DRYING AGENT

Proprietary wetting agent.

ANTI-TARNISH

Chromate anti-tarnish process.  Can be used electrolytically and/or immersion.

DURAWEAR

Chromate-free immersion anti-tarnish process.  Can be regenerated with replenisher chemistry.

CHEMPOL CB

Blend of dry acid activating salts formulated to remove tenacious films and oxides from copper and copper alloys.

TINOX

Antiquing process for gold deposits

NICKEL REDUCER FOR GOLD

Precipitates nickel ions from acid gold plating solutions.

NICKEL REDUCER FOR RHODIUM

Precipitates nickel ions from rhodium plating solutions.

ACTIUM I

Cyanide nickel activator.

ACTIUM II

Non-cyanide nickel activator.

GOLD BUG CATHODE

Cathodic target used to electrolytically remove gold ions from drag-outs.

GOLDMINER CATHODE

Cathodic target used to electrolytically remove gold ions from drag-outs.

CARBON FILTERS

Removes organic contaminants from plating solutions.

COTTON FILTERS

Removes small particulate matter from plating solutions.